Publication:
Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
| dc.contributor.author | Spessot, Alessio | |
| dc.contributor.author | Salahuddin, Shairfe Muhammad | |
| dc.contributor.author | Escobar Gavilanez, Ricardo | |
| dc.contributor.author | Ritzenthaler, Romain | |
| dc.contributor.author | Xiang, Yang | |
| dc.contributor.author | Budhwani, Rahul Kumar | |
| dc.contributor.author | Dentoni Litta, Eugenio | |
| dc.contributor.author | Capogreco, Elena | |
| dc.contributor.author | Bastos, Joao | |
| dc.contributor.author | Chen, Yangyin | |
| dc.contributor.author | Horiguchi, Naoto | |
| dc.contributor.imecauthor | Spessot, Alessio | |
| dc.contributor.imecauthor | Salahuddin, Shairfe Muhammad | |
| dc.contributor.imecauthor | Escobar Gavilanez, Ricardo | |
| dc.contributor.imecauthor | Ritzenthaler, Romain | |
| dc.contributor.imecauthor | Xiang, Yang | |
| dc.contributor.imecauthor | Budhwani, Rahul Kumar | |
| dc.contributor.imecauthor | Dentoni Litta, Eugenio | |
| dc.contributor.imecauthor | Capogreco, Elena | |
| dc.contributor.imecauthor | Bastos, Joao | |
| dc.contributor.imecauthor | Chen, Yangyin | |
| dc.contributor.imecauthor | Horiguchi, Naoto | |
| dc.contributor.orcidimec | Salahuddin, Shairfe Muhammad::0000-0002-6483-8430 | |
| dc.contributor.orcidimec | Ritzenthaler, Romain::0000-0002-8615-3272 | |
| dc.contributor.orcidimec | Xiang, Yang::0000-0003-0091-6935 | |
| dc.contributor.orcidimec | Bastos, Joao::0000-0002-8877-9850 | |
| dc.contributor.orcidimec | Horiguchi, Naoto::0000-0001-5490-0416 | |
| dc.contributor.orcidimec | Dentoni Litta, Eugenio::0000-0003-0333-376X | |
| dc.date.accessioned | 2023-06-13T10:02:02Z | |
| dc.date.available | 2022-10-30T02:55:00Z | |
| dc.date.available | 2023-06-13T10:02:02Z | |
| dc.date.issued | 2022 | |
| dc.identifier.doi | 10.1109/IMW52921.2022.9779308 | |
| dc.identifier.eisbn | 978-1-6654-9947-7 | |
| dc.identifier.issn | 2330-7978 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40643 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 148 | |
| dc.source.conference | 14th IEEE International Memory Workshop (IMW) | |
| dc.source.conferencedate | MAR 15-18, 2022 | |
| dc.source.conferencelocation | Dresden | |
| dc.source.endpage | 151 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 4 | |
| dc.subject.keywords | MEMORY | |
| dc.title | Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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