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Thermal fatigue reliability analysis of redistributed flip chip assemblies
Publication:
Thermal fatigue reliability analysis of redistributed flip chip assemblies
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Date
1998
Proceedings Paper
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2878.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Beyne, Eric
Journal
Abstract
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1772
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Acq. date: 2025-12-15
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Metrics
Views
1772
since deposited on 2021-10-01
1
last month
Acq. date: 2025-12-15
Citations