Publication:

Thermal fatigue reliability analysis of redistributed flip chip assemblies

Date

1998
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.accessioned2021-10-01T09:30:46Z
dc.date.available2021-10-01T09:30:46Z
dc.date.embargo9999-12-31
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3094
dc.source.beginpage37
dc.source.conference48th IEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/1998
dc.source.conferencelocationSeattle, WA USA
dc.source.endpage44
dc.title

Thermal fatigue reliability analysis of redistributed flip chip assemblies

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
2878.pdf
Size:
837.78 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions