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Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology
Publication:
Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology
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Date
2024
Proceedings Paper
https://doi.org/10.1109/ESSERC62670.2024.10719443
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kumar, Nitish
;
Chen, Yukai
;
Sankatali, Venkateswarlu
;
Mishra, Subrat
;
Gupta, Ankur
;
Singh, Pushpapraj
;
Catthoor, Francky
;
Myers, James
;
Ryckaert, Julien
;
Biswas, Dwaipayan
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N/A
Abstract
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271
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Acq. date: 2026-01-06
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Views
271
since deposited on 2025-02-02
1
last month
1
last week
Acq. date: 2026-01-06
Citations