Publication:

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Date

2024
Proceedings Paper
https://doi.org/10.1109/ESSERC62670.2024.10719443
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Author(s)

Kumar, Nitish  
;
Chen, Yukai  
;
Sankatali, Venkateswarlu  
;
Mishra, Subrat  
;
Gupta, Ankur
;
Singh, Pushpapraj
;
Catthoor, Francky  
;
Myers, James  
;
Ryckaert, Julien  
;
Biswas, Dwaipayan  

Journal

N/A

Abstract

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280 since deposited on 2025-02-02
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Acq. date: 2026-02-27

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