Publication:
Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology
| dc.contributor.author | Kumar, Nitish | |
| dc.contributor.author | Chen, Yukai | |
| dc.contributor.author | Sankatali, Venkateswarlu | |
| dc.contributor.author | Mishra, Subrat | |
| dc.contributor.author | Gupta, Ankur | |
| dc.contributor.author | Singh, Pushpapraj | |
| dc.contributor.author | Catthoor, Francky | |
| dc.contributor.author | Myers, James | |
| dc.contributor.author | Ryckaert, Julien | |
| dc.contributor.author | Biswas, Dwaipayan | |
| dc.contributor.imecauthor | Kumar, Nitish | |
| dc.contributor.imecauthor | Chen, Yukai | |
| dc.contributor.imecauthor | Sankatali, Venkateswarlu | |
| dc.contributor.imecauthor | Mishra, Subrat | |
| dc.contributor.imecauthor | Catthoor, Francky | |
| dc.contributor.imecauthor | Myers, James | |
| dc.contributor.imecauthor | Ryckaert, Julien | |
| dc.contributor.imecauthor | Biswas, Dwaipayan | |
| dc.contributor.orcidimec | Kumar, Nitish::0000-0002-9010-0712 | |
| dc.contributor.orcidimec | Chen, Yukai::0000-0003-3378-887X | |
| dc.contributor.orcidimec | Sankatali, Venkateswarlu::0000-0002-1616-6764 | |
| dc.contributor.orcidimec | Mishra, Subrat::0000-0002-1435-3275 | |
| dc.contributor.orcidimec | Catthoor, Francky::0000-0002-3599-8515 | |
| dc.contributor.orcidimec | Biswas, Dwaipayan::0000-0002-1087-3433 | |
| dc.date.accessioned | 2025-04-10T15:15:36Z | |
| dc.date.available | 2025-02-02T17:54:27Z | |
| dc.date.available | 2025-04-10T15:15:36Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ESSERC62670.2024.10719443 | |
| dc.identifier.eisbn | 979-8-3503-8813-8 | |
| dc.identifier.isbn | 979-8-3503-8814-5 | |
| dc.identifier.issn | 1930-8833 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45144 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 337 | |
| dc.source.conference | 50th IEEE European Solid-State Electronics Research Conference (ESSERC) | |
| dc.source.conferencedate | SEP 09-12, 2024 | |
| dc.source.conferencelocation | Bruges | |
| dc.source.endpage | 340 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 4 | |
| dc.title | Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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