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Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

 
dc.contributor.authorKumar, Nitish
dc.contributor.authorChen, Yukai
dc.contributor.authorSankatali, Venkateswarlu
dc.contributor.authorMishra, Subrat
dc.contributor.authorGupta, Ankur
dc.contributor.authorSingh, Pushpapraj
dc.contributor.authorCatthoor, Francky
dc.contributor.authorMyers, James
dc.contributor.authorRyckaert, Julien
dc.contributor.authorBiswas, Dwaipayan
dc.contributor.imecauthorKumar, Nitish
dc.contributor.imecauthorChen, Yukai
dc.contributor.imecauthorSankatali, Venkateswarlu
dc.contributor.imecauthorMishra, Subrat
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorMyers, James
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorBiswas, Dwaipayan
dc.contributor.orcidimecKumar, Nitish::0000-0002-9010-0712
dc.contributor.orcidimecChen, Yukai::0000-0003-3378-887X
dc.contributor.orcidimecSankatali, Venkateswarlu::0000-0002-1616-6764
dc.contributor.orcidimecMishra, Subrat::0000-0002-1435-3275
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecBiswas, Dwaipayan::0000-0002-1087-3433
dc.date.accessioned2025-04-10T15:15:36Z
dc.date.available2025-02-02T17:54:27Z
dc.date.available2025-04-10T15:15:36Z
dc.date.issued2024
dc.identifier.doi10.1109/ESSERC62670.2024.10719443
dc.identifier.eisbn979-8-3503-8813-8
dc.identifier.isbn979-8-3503-8814-5
dc.identifier.issn1930-8833
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45144
dc.publisherIEEE
dc.source.beginpage337
dc.source.conference50th IEEE European Solid-State Electronics Research Conference (ESSERC)
dc.source.conferencedateSEP 09-12, 2024
dc.source.conferencelocationBruges
dc.source.endpage340
dc.source.journalN/A
dc.source.numberofpages4
dc.title

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

dc.typeProceedings paper
dspace.entity.typePublication
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