Publication:

Temperature dependent electrical characteristics of through-si-via (TSV) interconnections

Date

2010

Proceedings Paper

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Author(s)

Katti, Guruprasad

;

Mercha, Abdelkarim

;

Stucchi, Michele

;

;

Velenis, Dimitrios

;

;

Huyghebaert, Cedric

;

;

Rakowski, Michal

;

Debusschere, Ingrid

;

Soussan, Philippe

;

;

;

De Meyer, Kristin

;

Travaly, Youssef

;

;

Biesemans, Serge

;

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Acq. date: 2026-01-25