Publication:

Temperature dependent electrical characteristics of through-si-via (TSV) interconnections

Date

2010
Proceedings Paper
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dc.contributor.authorKatti, Guruprasad
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorStucchi, Michele
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorJourdain, Anne
dc.contributor.authorRakowski, Michal
dc.contributor.authorDebusschere, Ingrid
dc.contributor.authorSoussan, Philippe
dc.contributor.authorOprins, Herman
dc.contributor.authorDehaene, Wim
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.authorBiesemans, Serge
dc.contributor.authorSwinnen, Bart
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorDebusschere, Ingrid
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-18T17:33:03Z
dc.date.available2021-10-18T17:33:03Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17353
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate6/06/2010
dc.source.conferencelocationBurlingame, CA USA
dc.title

Temperature dependent electrical characteristics of through-si-via (TSV) interconnections

dc.typeProceedings paper
dspace.entity.typePublication
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