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Conference contributions
Green mold compounds: impact on second level interconnect reliability
Publication:
Green mold compounds: impact on second level interconnect reliability
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Date
2011-12
Proceedings Paper
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23535.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Lofrano, Melina
;
Willems, Geert
Journal
Abstract
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1955
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last month
Acq. date: 2025-12-16
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Views
1955
since deposited on 2021-10-19
1
last month
Acq. date: 2025-12-16
Citations