Publication:

Green mold compounds: impact on second level interconnect reliability

Date

2011-12
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLofrano, Melina
dc.contributor.authorWillems, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-19T20:43:28Z
dc.date.available2021-10-19T20:43:28Z
dc.date.embargo9999-12-31
dc.date.issued2011-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20021
dc.source.beginpage283
dc.source.conference13th IEEE Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate7/12/2011
dc.source.conferencelocationSingapore Singapore
dc.source.endpage288
dc.title

Green mold compounds: impact on second level interconnect reliability

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
23535.pdf
Size:
1.23 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions