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Conference contributions
STI and eSiGe source/drain stressors induced stress modeling in 28 nm technology with replacement gate (RMG) process
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STI and eSiGe source/drain stressors induced stress modeling in 28 nm technology with replacement gate (RMG) process
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Date
2013
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jang, Doyoung
;
Garcia Bardon, Marie
;
Yakimets, Dmitry
;
Miyaguchi, Kenichi
;
De Keersgieter, An
;
Chiarella, Thomas
;
Ritzenthaler, Romain
;
Dehan, Morin
;
Mercha, Abdelkarim
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1986
since deposited on 2021-10-21
1
last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1986
since deposited on 2021-10-21
1
last month
Acq. date: 2025-12-15
Citations