Al3Sc thin films for advanced interconnect applications

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Published version 4.57 MB

Accepted version 1.25 MB

Author(s)

Soulie, Jean-Philippe

;

Sankaran, Kiroubanand

;

Founta, Valeria

;

;

Detavernier, Christophe

;

Van de Vondel, Joris

;

Pourtois, Geoffrey

;

;

;

Adelmann, Christoph

Journal

MICROELECTRONIC ENGINEERING

Metrics

626 since deposited on 2024-03-29

Acq. date: 2025-10-23