Publication:

Al3Sc thin films for advanced interconnect applications

Date

2024
Journal article
https://doi.org/10.1016/j.mee.2024.112141
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

Published version 4.57 MB
Accepted version 1.25 MB

Author(s)

Soulie, Jean-Philippe  
;
Sankaran, Kiroubanand  
;
Founta, Valeria  
;
Opsomer, Karl  
;
Detavernier, Christophe
;
Van de Vondel, Joris
;
Pourtois, Geoffrey  
;
Tokei, Zsolt  
;
Swerts, Johan  
;
Adelmann, Christoph  

Journal

MICROELECTRONIC ENGINEERING

Abstract

Description

Statistics

Downloads

101 since deposited on 2024-03-29
42last month
6last week
Acq. date: 2026-08-25

Views

645 since deposited on 2024-03-29
2last month
Acq. date: 2026-08-25

Citations

Statistics

Downloads

101 since deposited on 2024-03-29
42last month
6last week
Acq. date: 2026-08-25

Views

645 since deposited on 2024-03-29
2last month
Acq. date: 2026-08-25

Citations