Publication:

Al3Sc thin films for advanced interconnect applications

Date

2024
Journal article
https://doi.org/10.1016/j.mee.2024.112141
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dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorSankaran, Kiroubanand
dc.contributor.authorFounta, Valeria
dc.contributor.authorOpsomer, Karl
dc.contributor.authorDetavernier, Christophe
dc.contributor.authorVan de Vondel, Joris
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorTokei, Zsolt
dc.contributor.authorSwerts, Johan
dc.contributor.authorAdelmann, Christoph
dc.contributor.imecauthorSankaran, Kiroubanand
dc.contributor.imecauthorFounta, Valeria
dc.contributor.imecauthorOpsomer, Karl
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecSankaran, Kiroubanand::0000-0001-6988-7269
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecSwerts, Johan::0000-0001-7547-7194
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2024-08-29T13:30:45Z
dc.date.available2024-03-29T18:12:33Z
dc.date.available2024-08-29T13:30:45Z
dc.date.embargo2026-01-25
dc.date.issued2024
dc.description.wosFundingTextThis work was supported by imec's industrial affiliate program on nano -interconnects. The authors would like to thank Patrick Carolan, Hugo Bender, Kris Paulussen, Pieter Lagrain, Olivier Richard, Paola Favia, and Laura Nelissen for the TEM analysis; Inge Vaesen and Thierry Conard for the XPS profile; and the imec pline for their support.
dc.identifier.doi10.1016/j.mee.2024.112141
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43744
dc.publisherELSEVIER
dc.source.beginpageArt. 112141
dc.source.endpageN/A
dc.source.issue1 March
dc.source.journalMICROELECTRONIC ENGINEERING
dc.source.numberofpages6
dc.source.volume286
dc.subject.keywordsINTERMETALLIC COMPOUNDS
dc.subject.keywordsRESISTIVITY
dc.title

Al3Sc thin films for advanced interconnect applications

dc.typeJournal article
dspace.entity.typePublication
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