Process Optimization of MP18 Semi-Damascene Interconnects with Fully Self-Aligned Vias at Sub-2nm Nodes

dc.contributor.author	Soussou, A.
dc.contributor.author	Marti, Giulio
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Park, Seongho
dc.contributor.author	Vincent, B.
dc.contributor.imecauthor	Marti, Giulio
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Park, Seongho
dc.contributor.orcidimec	Tokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimec	Park, Seongho::0000-0002-1058-9424
dc.date.accessioned	2025-07-23T09:19:37Z
dc.date.available	2024-06-06T18:31:01Z
dc.date.available	2025-07-23T09:19:37Z
dc.date.issued	2024
dc.identifier.doi	10.1117/12.3010814
dc.identifier.eisbn	978-1-5106-7223-9
dc.identifier.isbn	978-1-5106-7222-2
dc.identifier.issn	0277-786X
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/43998
dc.publisher	SPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage	Art. 1295807
dc.source.conference	Conference on Advanced Etch Technology and Process Integration for Nanopatterning XIII
dc.source.conferencedate	FEB 26-29, 2024
dc.source.conferencelocation	San Jose
dc.source.journal	Proceedings of SPIE
dc.source.numberofpages	4
dc.source.volume	12958
dc.title	Process Optimization of MP18 Semi-Damascene Interconnects with Fully Self-Aligned Vias at Sub-2nm Nodes
dc.type	Proceedings paper
dspace.entity.type	Publication
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