Publication:

Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits

Date

2024
Journal article
https://doi.org/10.1002/aelm.202400035
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Author(s)

Erofeev, Ivan
;
Hartanto, Antony Winata
;
Saidov, Khakimjon
;
Aabdin, Zainul
;
Pacco, Antoine  
;
Philipsen, Harold  
;
Tjiu, Weng Weei
;
Hui, Hui Kim
;
Holsteyns, Frank  
;
Mirsaidov, Utkur

Journal

ADVANCED ELECTRONIC MATERIALS

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393 since deposited on 2024-07-04
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659 since deposited on 2024-07-04
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