Publication:
Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers
Date
| dc.contributor.author | Bruynseraede, Christophe | |
| dc.contributor.author | Fisher, A.H. | |
| dc.contributor.author | Ungar, F. | |
| dc.contributor.author | Schuhmacher, Jorg | |
| dc.contributor.author | Sutcliffe, Victor | |
| dc.contributor.author | Michelon, Julien | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.date.accessioned | 2021-10-15T12:48:30Z | |
| dc.date.available | 2021-10-15T12:48:30Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8645 | |
| dc.source.beginpage | 12 | |
| dc.source.conference | Proceedings of the IEEE International Interconnect Technology Conference | |
| dc.source.conferencedate | 7/06/2004 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.source.endpage | 14 | |
| dc.title | Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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