3D-printed optical probes for wafer-level testing of photonic integrated circuits

Trappen, Mareike; Blaicher, Matthias; Dietrich, Philipp-Immanuel; Dankwart, Colin; Xu, Yilin; Hoose, Tobias; Billah, Muhammad Rodlin; Abbasi, Amin; Baets, Roel; Troppenz, Ute; Theurer, Michael; Woerhoff, Kerstin; Seyfried, Moritz; Freude, Wolfgang; Koos, Christian

doi:10.1364/oe.405139

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3D-printed optical probes for wafer-level testing of photonic integrated circuits

Date

2020

Journal article

https://doi.org/10.1364/oe.405139

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3D-printed_optical_probes_for_wafer-level_testing_of_photonic_integrated_circuits 2.81 MB

Author(s)

Trappen, Mareike

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Blaicher, Matthias

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Dietrich, Philipp-Immanuel

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Dankwart, Colin

;

Xu, Yilin

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Hoose, Tobias

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Billah, Muhammad Rodlin

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;

;

;

;

;

Journal

OPTICS EXPRESS

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3D-printed optical probes for wafer-level testing of photonic integrated circuits

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