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Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
Publication:
Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
Date
2017
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Iwasaki, Akihisa
;
Akanishi, Yuya
;
Matsumoto, Fulvio
;
Kesters, Els
;
Le, Quoc Toan
;
Holsteyns, Frank
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Abstract
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1935
since deposited on 2021-10-24
412
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1935
since deposited on 2021-10-24
412
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations