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Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments

Date

2017
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dc.contributor.authorIwasaki, Akihisa
dc.contributor.authorAkanishi, Yuya
dc.contributor.authorMatsumoto, Fulvio
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorAkanishi, Yuya
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-24T06:10:30Z
dc.date.available2021-10-24T06:10:30Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28574
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2017-02/24/1079.abstract
dc.source.beginpage1079
dc.source.conference232nd ECS Fall Meeting: 15th International Symposium on Semiconductor Cleaning Science and Technology - SCST15
dc.source.conferencedate1/10/2017
dc.source.conferencelocationNational Harbor, MD USA
dc.title

Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments

dc.typeMeeting abstract
dspace.entity.typePublication
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