Publication:

Mechanical stability of airgaps in nano-interconnects

Date

2020
Journal article
https://doi.org/10.1016/j.microrel.2020.113597
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dc.contributor.authorVanstreels, Kris
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorGonzalez, Mario
dc.contributor.imecauthorVanstreels, K.
dc.contributor.imecauthorZahedmanesh, H.
dc.contributor.imecauthorGonzalez, M.
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.date.accessioned2021-11-26T11:24:53Z
dc.date.available2021-11-02T16:06:49Z
dc.date.available2021-11-26T11:24:53Z
dc.date.issued2020
dc.identifier.doi10.1016/j.microrel.2020.113597
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38310
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD
dc.source.beginpage113597
dc.source.issuena
dc.source.journalMICROELECTRONICS RELIABILITY
dc.source.numberofpages8
dc.source.volume107
dc.subject.keywordsFRACTURE ENERGY
dc.subject.keywordsINTEGRITY
dc.subject.keywordsFILMS
dc.title

Mechanical stability of airgaps in nano-interconnects

dc.typeJournal article
dspace.entity.typePublication
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