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TSV first and last: through-Si via technologies for 3D SIC and 3D WLP - part 2

Date

2009-01
Journal article
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dc.contributor.authorProvoost, Jan
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorProvoost, Jan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-18T01:57:41Z
dc.date.available2021-10-18T01:57:41Z
dc.date.issued2009-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16060
dc.identifier.urlhttp://www.electroiq.com/index/display/packaging-article-display/351021/s-articles/s-advanced-packaging/s-packag
dc.source.journalElectroIQ
dc.title

TSV first and last: through-Si via technologies for 3D SIC and 3D WLP - part 2

dc.typeJournal article
dspace.entity.typePublication
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