Publication:
Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology
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1889 since deposited on 2021-10-19
6last month
Acq. date: 2026-01-05
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Views
1889 since deposited on 2021-10-19
6last month
Acq. date: 2026-01-05
Citations