Publication:

Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

Date

Loading...
Thumbnail Image

Abstract

Description

Metrics

Views

1882 since deposited on 2021-10-19
Acq. date: 2025-10-25

Citations

Metrics

Views

1882 since deposited on 2021-10-19
Acq. date: 2025-10-25

Citations