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Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology
Publication:
Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology
Date
2011
Proceedings Paper
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23548.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Enayati, Amin
;
Brebels, Steven
;
Vandenbosch, Guy
;
De Raedt, Walter
;
Raisanen, Antti
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Abstract
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1882
since deposited on 2021-10-19
Acq. date: 2025-10-25
Citations
Metrics
Views
1882
since deposited on 2021-10-19
Acq. date: 2025-10-25
Citations