Publication:
Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology
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1888 since deposited on 2021-10-19
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Acq. date: 2025-12-10
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1888 since deposited on 2021-10-19
5last month
5last week
Acq. date: 2025-12-10
Citations