Publication:

Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

Date

2011
Proceedings Paper
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dc.contributor.authorEnayati, Amin
dc.contributor.authorBrebels, Steven
dc.contributor.authorVandenbosch, Guy
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorRaisanen, Antti
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-19T13:24:38Z
dc.date.available2021-10-19T13:24:38Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18879
dc.identifier.urlhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5973570
dc.source.conferenceInternational Microwave Symposium Digest - MTT
dc.source.conferencedate5/06/2011
dc.source.conferencelocationBaltimore, MD USA
dc.title

Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

dc.typeProceedings paper
dspace.entity.typePublication
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