Crack initiation for kerf-loss-free wafering

dc.contributor.author	Qian, Jun
dc.contributor.author	Kersschot, Bruno
dc.contributor.author	Masolin, Alex
dc.contributor.author	Vaes, Jan
dc.contributor.author	Dross, Frederic
dc.contributor.author	Reynaerts, Dominiek
dc.date.accessioned	2021-10-19T17:45:25Z
dc.date.available	2021-10-19T17:45:25Z
dc.date.issued	2011
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/19636
dc.identifier.url	http://www.euspen.eu/default.asp?langid=1&contentid=1451
dc.source.beginpage	458
dc.source.conference	11th International Conference of the European Society for Precision Engineering & Nanotechnology - euspen
dc.source.conferencedate	23/05/2011
dc.source.conferencelocation	Como Italy
dc.source.endpage	461
dc.title	Crack initiation for kerf-loss-free wafering
dc.type	Proceedings paper
dspace.entity.type	Publication
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