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Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Publication:
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Date
2021
Proceedings Paper
https://doi.org/10.1109/CASE49439.2021.9551575
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Koegel, Michael
;
Brand, Sebastian
;
Grosse, Christian
;
Jacobs, Kristof J.P.
;
De Wolf, Ingrid
;
Altmann, Frank
Journal
na
Abstract
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1148
since deposited on 2023-06-20
Acq. date: 2025-10-27
Citations
Metrics
Views
1148
since deposited on 2023-06-20
Acq. date: 2025-10-27
Citations