Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Publication:
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Copy permalink
Date
2021
Proceedings Paper
https://doi.org/10.1109/CASE49439.2021.9551575
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Koegel, Michael
;
Brand, Sebastian
;
Grosse, Christian
;
Jacobs, Kristof J.P.
;
De Wolf, Ingrid
;
Altmann, Frank
Journal
na
Abstract
Description
Metrics
Views
1152
since deposited on 2023-06-20
4
last month
2
last week
Acq. date: 2026-01-11
Citations
Metrics
Views
1152
since deposited on 2023-06-20
4
last month
2
last week
Acq. date: 2026-01-11
Citations