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Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)

 
dc.contributor.authorKoegel, Michael
dc.contributor.authorBrand, Sebastian
dc.contributor.authorGrosse, Christian
dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorAltmann, Frank
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidextBrand, Sebastian::0000-0003-1195-6326
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.date.accessioned2023-08-08T10:08:17Z
dc.date.available2023-06-20T10:39:43Z
dc.date.available2023-08-08T10:08:17Z
dc.date.issued2021
dc.identifier.doi10.1109/CASE49439.2021.9551575
dc.identifier.eisbn978-1-6654-1873-7
dc.identifier.issn2161-8070
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42063
dc.publisherIEEE
dc.source.beginpage395
dc.source.conference17th IEEE International Conference on Automation Science and Engineering (CASE)
dc.source.conferencedateAUG 23-27, 2021
dc.source.conferencelocationLyon
dc.source.endpage400
dc.source.journalna
dc.source.numberofpages6
dc.title

Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)

dc.typeProceedings paper
dspace.entity.typePublication
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