CMOS compatible 2D material integration for Sensor Applications on 200mm wafers

Abstract

Two-dimensional (2D) materials show promising potential due to their electrical, photonic, and mechanical properties. While these materials are heavily researched for shrinking the size of transistors, their application in sensors and actuators field is just beginning. Challenge lies in integrating stable and reliable devices made from 2D materials using standard silicon-based CMOS fabrication tools. Due to defectivity, adhesion problems, and sensitivity to process conditions like temperature, the options for fabrication are limited. In our study, we highlight the challenges of integrating 2D materials in conventional fabrication conditions and explore methods for handling materials like graphene and MoS2 in a 200mm CMOS facility, paving the way for their use in sensors and actuators.