Publication:

N5 technology node dual-damascene interconnects enabled using multi patterning

Date

2017
Proceedings Paper
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dc.contributor.authorBriggs, Basoene
dc.contributor.authorWilson, Chris
dc.contributor.authorDevriendt, Katia
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorDecoster, Stefan
dc.contributor.authorPaolillo, Sara
dc.contributor.authorVersluijs, Janko
dc.contributor.authorKesters, Els
dc.contributor.authorSebaai, Farid
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorWan, Danny
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCroes, Kristof
dc.contributor.authorDutta, Shibesh
dc.contributor.authorRyckaert, Julien
dc.contributor.authorMallik, Arindam
dc.contributor.authorLariviere, Stephane
dc.contributor.imecauthorBriggs, Basoene
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorWan, Danny
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorLariviere, Stephane
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecWan, Danny::0000-0003-4847-3184
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.date.accessioned2021-10-24T03:11:12Z
dc.date.available2021-10-24T03:11:12Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27936
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7968983/
dc.source.beginpage1
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate16/05/2017
dc.source.conferencelocationHsinchu Taiwan
dc.source.endpage3
dc.title

N5 technology node dual-damascene interconnects enabled using multi patterning

dc.typeProceedings paper
dspace.entity.typePublication
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