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Role of bath composition in electroless Cu seeding on Co liner for through-Si vias

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dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorArmini, Silvia
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTanaka, Tetsu
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-22T19:51:08Z
dc.date.available2021-10-22T19:51:08Z
dc.date.issued2015-01
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25416
dc.identifier.urlhttp://dx.doi.org/10.1149/2.0131501jss
dc.source.beginpageN3108
dc.source.endpageN3112
dc.source.issue1
dc.source.journalECS Journal of Solid State Science and Technology
dc.source.volume4
dc.title

Role of bath composition in electroless Cu seeding on Co liner for through-Si vias

dc.typeJournal article
dspace.entity.typePublication
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