Publication:

Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck

Date

2020
Proceedings Paper
https://doi.org/10.1109/IEDM13553.2020.9371903
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dc.contributor.authorTokei, Zsolt
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorO'Toole, Martin
dc.contributor.authorCroes, Kristof
dc.contributor.authorBaert, Rogier
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorWilson, Chris
dc.contributor.authorPark, Seongho
dc.contributor.authorSankaran, Kiroubanand
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorSwerts, Johan
dc.contributor.authorPaolillo, Sara
dc.contributor.authorDecoster, Stefan
dc.contributor.authorMao, Ming
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorVersluijs, Janko
dc.contributor.imecauthorTokei, Zs
dc.contributor.imecauthorVega, V.
dc.contributor.imecauthorMurdoch, G.
dc.contributor.imecauthorO'Toole, M.
dc.contributor.imecauthorCroes, K.
dc.contributor.imecauthorBaert, R.
dc.contributor.imecauthorVan der Veen, M.
dc.contributor.imecauthorAdelmann, C.
dc.contributor.imecauthorSoulie, J. P.
dc.contributor.imecauthorBoemmels, J.
dc.contributor.imecauthorWilson, C.
dc.contributor.imecauthorPark, S. H.
dc.contributor.imecauthorSankaran, K.
dc.contributor.imecauthorPourtois, G.
dc.contributor.imecauthorSweerts, J.
dc.contributor.imecauthorPaolillo, S.
dc.contributor.imecauthorDecoster, S.
dc.contributor.imecauthorMao, M.
dc.contributor.imecauthorLazzarino, F.
dc.contributor.imecauthorVersluijs, J.
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecSankaran, Kiroubanand::0000-0001-6988-7269
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecMorin, Pierre::0000-0002-4637-496X
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned2021-12-21T13:12:09Z
dc.date.available2021-12-06T02:06:35Z
dc.date.available2021-12-21T13:12:09Z
dc.date.issued2020
dc.identifier.doi10.1109/IEDM13553.2020.9371903
dc.identifier.eisbn978-1-7281-8888-1
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38547
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 12-18, 2020
dc.source.conferencelocationSan Francisco, CA, USA
dc.source.journalna
dc.source.numberofpages4
dc.title

Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck

dc.typeProceedings paper
dspace.entity.typePublication
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