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Effects of pre-amorphization implantation (PAI) in ultra shallow junctions formed by SPER in deep sub-micron devices
Publication:
Effects of pre-amorphization implantation (PAI) in ultra shallow junctions formed by SPER in deep sub-micron devices
Date
2004-01
Proceedings Paper
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9270.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Severi, Simone
;
Henson, Kirklen
;
Lindsay, Richard
;
De Meyer, Kristin
Journal
Abstract
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1
since deposited on 2021-10-15
Acq. date: 2025-10-22
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1850
since deposited on 2021-10-15
Acq. date: 2025-10-22
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Downloads
1
since deposited on 2021-10-15
Acq. date: 2025-10-22
Views
1850
since deposited on 2021-10-15
Acq. date: 2025-10-22
Citations