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Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using of oxygen free fluorcarbon plasma
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1821 since deposited on 2021-10-16
1last month
Acq. date: 2026-06-06
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Statistics
Views
1821 since deposited on 2021-10-16
1last month
Acq. date: 2026-06-06
Citations