Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes

dc.contributor.author	Kumaresan, Vishnuvarthan
dc.contributor.author	Wilson, Chris
dc.contributor.author	Verdonck, Patrick
dc.contributor.author	Van Besien, Els
dc.contributor.author	Lazzarino, Frederic
dc.contributor.author	Truffert, Vincent
dc.contributor.author	Boemmels, Juergen
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Wong, T.K.S.
dc.contributor.imecauthor	Wilson, Chris
dc.contributor.imecauthor	Verdonck, Patrick
dc.contributor.imecauthor	Van Besien, Els
dc.contributor.imecauthor	Lazzarino, Frederic
dc.contributor.imecauthor	Truffert, Vincent
dc.contributor.imecauthor	Boemmels, Juergen
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.orcidimec	Verdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimec	Van Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimec	Lazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimec	Truffert, Vincent::0000-0001-7851-830X
dc.date.accessioned	2021-10-22T02:45:04Z
dc.date.available	2021-10-22T02:45:04Z
dc.date.issued	2014
dc.identifier.issn	0167-9317
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/24081
dc.identifier.url	http://www.sciencedirect.com/science/article/pii/S0167931713006928
dc.source.beginpage	90
dc.source.endpage	94
dc.source.journal	Microelectronic Engineering
dc.source.volume	120
dc.title	Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes
dc.type	Journal article
dspace.entity.type	Publication
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