Publication:

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Date

2021
Journal article
https://doi.org/10.1109/LED.2021.3124960
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Author(s)

Inoue, Fumihiro  
;
Iacovo, Serena  
;
El-Mekki, Zaid  
;
Kim, Soon-Wook  
;
Struyf, Herbert  
;
Beyne, Eric  

Journal

IEEE ELECTRON DEVICE LETTERS

Abstract

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1770 since deposited on 2021-12-04
Acq. date: 2026-03-17

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1770 since deposited on 2021-12-04
Acq. date: 2026-03-17

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