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Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Publication:
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Date
2021
Journal article
https://doi.org/10.1109/LED.2021.3124960
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Inoue, Fumihiro
;
Iacovo, Serena
;
El-Mekki, Zaid
;
Kim, Soon-Wook
;
Struyf, Herbert
;
Beyne, Eric
Journal
IEEE ELECTRON DEVICE LETTERS
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1763
since deposited on 2021-12-04
Acq. date: 2025-10-27
Citations
Metrics
Views
1763
since deposited on 2021-12-04
Acq. date: 2025-10-27
Citations