Publication:
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
| dc.contributor.author | Inoue, Fumihiro | |
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | El-Mekki, Zaid | |
| dc.contributor.author | Kim, Soon-Wook | |
| dc.contributor.author | Struyf, Herbert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Inoue, Fumihiro | |
| dc.contributor.imecauthor | Iacovo, Serena | |
| dc.contributor.imecauthor | El-Mekki, Zaid | |
| dc.contributor.imecauthor | Kim, Soon-Wook | |
| dc.contributor.imecauthor | Struyf, Herbert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2022-04-25T09:50:17Z | |
| dc.date.available | 2021-12-04T02:06:10Z | |
| dc.date.available | 2022-04-01T15:14:25Z | |
| dc.date.available | 2022-04-25T09:50:17Z | |
| dc.date.issued | 2021 | |
| dc.identifier.doi | 10.1109/LED.2021.3124960 | |
| dc.identifier.issn | 0741-3106 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38529 | |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | |
| dc.source.beginpage | 1826 | |
| dc.source.endpage | 1829 | |
| dc.source.issue | 12 | |
| dc.source.journal | IEEE ELECTRON DEVICE LETTERS | |
| dc.source.numberofpages | 4 | |
| dc.source.volume | 42 | |
| dc.subject.keywords | LAYER | |
| dc.title | Area-Selective Electroless Deposition of Cu for Hybrid Bonding | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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