Publication:

EUV Single Patterning Exploration for Pitch 28 nm

Date

2021-02-22
Proceedings Paper
https://doi.org/10.1117/12.2584730
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dc.contributor.authorXu, Dongbo
dc.contributor.authorGillijns, Werner
dc.contributor.authorDrissi, Youssef
dc.contributor.authorTan, Ling Ee
dc.contributor.authorOak, Apoorva
dc.contributor.authorKim, Ryan Ryoung han
dc.contributor.editorYuan, Chi-Min
dc.contributor.editorKim, Ryan Ryoung
dc.contributor.imecauthorXu, Dongbo
dc.contributor.imecauthorGillijns, Werner
dc.contributor.imecauthorDrissi, Youssef
dc.contributor.imecauthorTan, Ling Ee
dc.contributor.imecauthorOak, Apoorva
dc.contributor.imecauthorKim, Ryan Ryoung han
dc.contributor.orcidimecXu, Dongbo::0000-0003-1159-2315
dc.contributor.orcidimecGillijns, Werner::0000-0002-2430-7360
dc.contributor.orcidimecTan, Ling Ee::0000-0002-3143-5176
dc.contributor.orcidimecOak, Apoorva::0000-0002-0926-848X
dc.date.accessioned2022-06-24T07:50:48Z
dc.date.available2021-11-02T15:59:40Z
dc.date.available2022-05-17T07:57:01Z
dc.date.available2022-06-24T07:50:48Z
dc.date.issued2021-02-22
dc.identifier.doi10.1117/12.2584730
dc.identifier.eisbn978-1-5106-4062-7
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37771
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.conferenceConference on Design-Process-Technology Co-optimization XV
dc.source.conferencedateFEB 22-26, 2021
dc.source.conferencelocationonline
dc.source.journalSPIE paper
dc.source.numberofpages12
dc.source.volume11614
dc.subject.keywordsDesign Rule, Design Retarget, EUV Lithography, NTD Process, EUV Single Patterning
dc.title

EUV Single Patterning Exploration for Pitch 28 nm

dc.typeProceedings paper
dspace.entity.typePublication
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