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Ru Stress Assessment by Membrane Wrinkling for Interconnect Applications
Publication:
Ru Stress Assessment by Membrane Wrinkling for Interconnect Applications
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Date
2023
Proceedings Paper
https://doi.org/10.1109/EDTM55494.2023.10103023
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Founta, Valeria
;
Soulie, Jean-Philippe
;
De Wolf, Ingrid
;
Van de Vondel, Joris
;
Swerts, Johan
;
Tokei, Zsolt
;
Adelmann, Christoph
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na
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973
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Acq. date: 2025-12-15
Citations
Metrics
Views
973
since deposited on 2023-09-03
6
last month
4
last week
Acq. date: 2025-12-15
Citations