Publication:

Ru Stress Assessment by Membrane Wrinkling for Interconnect Applications

Date

2023
Proceedings Paper
https://doi.org/10.1109/EDTM55494.2023.10103023
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dc.contributor.authorFounta, Valeria
dc.contributor.authorSoulie, Jean-Philippe
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVan de Vondel, Joris
dc.contributor.authorSwerts, Johan
dc.contributor.authorTokei, Zsolt
dc.contributor.authorAdelmann, Christoph
dc.contributor.imecauthorFounta, Valeria
dc.contributor.imecauthorSoulie, Jean-Philippe
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.orcidimecSoulie, Jean-Philippe::0000-0002-5956-6485
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecSwerts, Johan::0000-0001-7547-7194
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2023-12-18T11:51:27Z
dc.date.available2023-09-03T17:38:58Z
dc.date.available2023-12-18T11:51:27Z
dc.date.issued2023
dc.description.wosFundingTextThis work was supported by imec's industrial affiliate program on nano-interconnects and the department of Physics and Astronomy at KUL. The authors gratefully acknowledge the contributions of imec's MCA lab for the TEM images. V.F. acknowledges the support of a PhD scholarship from the Fonds Wetenschappelijk Onderzoek - Vlaanderen (FWO).
dc.identifier.doi10.1109/EDTM55494.2023.10103023
dc.identifier.eisbn979-8-3503-3252-0
dc.identifier.issnna
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42456
dc.publisherIEEE
dc.source.conference7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
dc.source.conferencedateMAR 07-10, 2023
dc.source.conferencelocationSeoul
dc.source.journalna
dc.source.numberofpages3
dc.title

Ru Stress Assessment by Membrane Wrinkling for Interconnect Applications

dc.typeProceedings paper
dspace.entity.typePublication
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