Publication:

Thermal analysis of advanced back-end-of-line structures and the impact of design parameters

Date

2022-09-30
Proceedings Paper
https://doi.org/10.1109/iTherm54085.2022.9899564
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dc.contributor.authorChang, Xinyue
dc.contributor.authorOprins, Herman
dc.contributor.authorLofrano, Melina
dc.contributor.authorVermeersch, Bjorn
dc.contributor.authorCiofi, Ivan
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorChang, Xinyue
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorVermeersch, Bjorn
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecChang, Xinyue::0000-0003-1875-6132
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVermeersch, Bjorn::0000-0001-8640-672X
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecLofrano, Melina::0000-0002-3930-6459
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.date.accessioned2024-01-02T11:11:14Z
dc.date.available2022-11-16T13:54:33Z
dc.date.available2024-01-02T11:11:14Z
dc.date.embargo2022-06-03
dc.date.issued2022-09-30
dc.identifier.doi10.1109/iTherm54085.2022.9899564
dc.identifier.eisbn978-1-6654-8503-6
dc.identifier.isbn978-1-6654-8502-9
dc.identifier.issn2694-2135
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40747
dc.source.conference2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
dc.source.conferencedate31 May 2022 - 03 June 2022
dc.source.conferencelocationSan Diego, CA, USA
dc.source.journalN/A
dc.source.numberofpages8
dc.subject.disciplinePhysics
dc.subject.keywordsBack-end-of-line
dc.subject.keywordsMaterial property
dc.subject.keywordsVia density
dc.subject.keywordsbarrier
dc.subject.keywordsFEM
dc.subject.keywordsthermal modeling
dc.title

Thermal analysis of advanced back-end-of-line structures and the impact of design parameters

dc.typeProceedings paper
dspace.entity.typePublication
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