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Copper plating for 3d interconnects
Publication:
Copper plating for 3d interconnects
Date
2010
Proceedings Paper
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20546.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Radisic, Alex
;
Luhn, Ole
;
Vaes, Jan
;
Armini, Silvia
;
El-Mekki, Zaid
;
Radisic, Dunja
;
Ruythooren, Wouter
;
Vereecken, Philippe
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Abstract
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Views
1973
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
1973
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations