Publication:

Copper plating for 3d interconnects

Date

2010
Proceedings Paper
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dc.contributor.authorRadisic, Alex
dc.contributor.authorLuhn, Ole
dc.contributor.authorVaes, Jan
dc.contributor.authorArmini, Silvia
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorRadisic, Dunja
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVereecken, Philippe
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorRadisic, Dunja
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-18T20:41:57Z
dc.date.available2021-10-18T20:41:57Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17864
dc.source.beginpage119
dc.source.conferenceProcessing, Materials, and Integration of Damascene and 3D Interconnects
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
dc.source.endpage125
dc.title

Copper plating for 3d interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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