Publication:
Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
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1887 since deposited on 2021-10-17
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Acq. date: 2026-10-10
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Statistics
Views
1887 since deposited on 2021-10-17
4last month
4last week
Acq. date: 2026-10-10
Citations