Publication:
FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3
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2057 since deposited on 2021-10-29
7last month
Acq. date: 2025-12-16
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Views
2057 since deposited on 2021-10-29
7last month
Acq. date: 2025-12-16
Citations