Publication:

FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3

Date

2020
Meeting abstract
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dc.contributor.authorTao, Zheng
dc.contributor.authorZhang, Liping
dc.contributor.authorDupuy, Emmanuel
dc.contributor.authorChan, BT
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorLazzarino, Frederic
dc.contributor.imecauthorTao, Zheng
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorDupuy, Emmanuel
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.orcidimecDupuy, Emmanuel::0000-0003-3341-1618
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.date.accessioned2021-10-29T05:11:58Z
dc.date.available2021-10-29T05:11:58Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/36052
dc.identifier.urlhttps://doi.org/10.1117/12.2552022
dc.source.beginpage113290O
dc.source.conferenceAdvanced Etch Technology for Nanopatterning IX
dc.source.conferencedate23/02/2020
dc.source.conferencelocationSan Jose USA
dc.title

FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3

dc.typeMeeting abstract
dspace.entity.typePublication
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