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Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal
Publication:
Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal
Date
2017
Proceedings Paper
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35639.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chew, Soon Aik
;
Yu, Hao
;
Schaekers, Marc
;
Demuynck, Steven
;
Mannaert, Geert
;
Kunnen, Eddy
;
Rosseel, Erik
;
Hikavyy, Andriy
;
Dangol, Anish
;
De Meyer, Kristin
;
Mocuta, Dan
;
Horiguchi, Naoto
;
Leusink, Gert
;
Wajda, Cory
;
Hakamata, T
;
Hasegawa, T
;
Tapily, K
;
Clark, R
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Acq. date: 2025-10-26
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2033
since deposited on 2021-10-24
Acq. date: 2025-10-26
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Downloads
1
since deposited on 2021-10-24
Acq. date: 2025-10-26
Views
2033
since deposited on 2021-10-24
Acq. date: 2025-10-26
Citations