Publication:

Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

Date

2017
Proceedings Paper
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dc.contributor.authorChew, Soon Aik
dc.contributor.authorYu, Hao
dc.contributor.authorSchaekers, Marc
dc.contributor.authorDemuynck, Steven
dc.contributor.authorMannaert, Geert
dc.contributor.authorKunnen, Eddy
dc.contributor.authorRosseel, Erik
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorDangol, Anish
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorMocuta, Dan
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorLeusink, Gert
dc.contributor.authorWajda, Cory
dc.contributor.authorHakamata, T
dc.contributor.authorHasegawa, T
dc.contributor.authorTapily, K
dc.contributor.authorClark, R
dc.contributor.imecauthorYu, Hao
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorMannaert, Geert
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorDangol, Anish
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecYu, Hao::0000-0002-1976-0259
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.accessioned2021-10-24T03:27:14Z
dc.date.available2021-10-24T03:27:14Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28023
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7968969/
dc.source.beginpage1
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate16/05/2017
dc.source.conferencelocationHsinchu Taiwan
dc.source.endpage3
dc.title

Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

dc.typeProceedings paper
dspace.entity.typePublication
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