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Thermal stability concern of metal-insulator-semiconductor contact: a case study of Ti/TiO2/n-Si contact
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Thermal stability concern of metal-insulator-semiconductor contact: a case study of Ti/TiO2/n-Si contact
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Date
2016
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33729.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Yu, Hao
;
Schaekers, Marc
;
Schram, Tom
;
Demuynck, Steven
;
Horiguchi, Naoto
;
Barla, Kathy
;
Collaert, Nadine
;
Thean, Aaron
;
De Meyer, Kristin
Journal
IEEE Transactions on Electron Devices
Abstract
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1809
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations
Metrics
Views
1809
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations