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Thermal stability concern of metal-insulator-semiconductor contact: a case study of Ti/TiO2/n-Si contact

Date

2016
Journal article
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dc.contributor.authorYu, Hao
dc.contributor.authorSchaekers, Marc
dc.contributor.authorSchram, Tom
dc.contributor.authorDemuynck, Steven
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorBarla, Kathy
dc.contributor.authorCollaert, Nadine
dc.contributor.authorThean, Aaron
dc.contributor.authorDe Meyer, Kristin
dc.contributor.imecauthorYu, Hao
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorBarla, Kathy
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorThean, Aaron
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.orcidimecYu, Hao::0000-0002-1976-0259
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecSchram, Tom::0000-0003-1533-7055
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2021-10-23T17:40:57Z
dc.date.available2021-10-23T17:40:57Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27644
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7476867
dc.source.beginpage2671
dc.source.endpage2676
dc.source.issue7
dc.source.journalIEEE Transactions on Electron Devices
dc.source.volume63
dc.title

Thermal stability concern of metal-insulator-semiconductor contact: a case study of Ti/TiO2/n-Si contact

dc.typeJournal article
dspace.entity.typePublication
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