Publication:

Thermal-Mechanical analysis of Electroplated copper for IC packaging

Date

2024
Proceedings Paper
https://doi.org/10.1109/estc60143.2024.10712132
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Author(s)

Salahouelhadj, Abdellah  
;
Vanstreels, Kris  
;
De Messemaeker, Joke  
;
Gerets, Carine  
;
Slabbekoorn, John  
;
El-Mekki, Zaid  
;
Mudigere Krishne Gowda, Punith  
;
Gonzalez, Mario  
;
Beyne, Eric  

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