Publication:

Thermal-Mechanical analysis of Electroplated copper for IC packaging

Date

2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712132
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dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorVanstreels, Kris
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorGerets, Carine
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorMudigere Krishne Gowda, Punith
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSalahouelhadj, A.
dc.contributor.imecauthorVanstreels, K.
dc.contributor.imecauthorDe Messemaeker, J.
dc.contributor.imecauthorGerets, C.
dc.contributor.imecauthorSlabbekoorn, J.
dc.contributor.imecauthorEl-Mekki, Z.
dc.contributor.imecauthorGowda, P. K. Mudigere Krishne
dc.contributor.imecauthorGonzalez, M.
dc.contributor.imecauthorBeyne, E.
dc.date.accessioned2025-02-15T21:14:40Z
dc.date.available2025-02-15T21:14:40Z
dc.date.issued2024
dc.identifier.doi10.1109/ESTC60143.2024.10712132
dc.identifier.eisbn979-8-3503-9036-0
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45216
dc.publisherIEEE
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedate2024-09-11
dc.source.conferencelocationBerlin
dc.source.numberofpages7
dc.subject.keywordsELASTIC-MODULUS
dc.subject.keywordsGRAIN-SIZE
dc.subject.keywordsFILMS
dc.subject.keywordsSTRESS
dc.subject.keywordsHARDNESS
dc.subject.keywordsINDENTATION
dc.title

Thermal-Mechanical analysis of Electroplated copper for IC packaging

dc.typeProceedings paper
dspace.entity.typePublication
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