Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
CMP processing to enable 3D stacked IC integration
Publication:
CMP processing to enable 3D stacked IC integration
Date
2009
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vaes, Jan
;
Heylen, Nancy
;
Van Olmen, Jan
;
Huyghebaert, Cedric
;
Leunissen, Peter
Journal
Abstract
Description
Metrics
Views
2008
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
2008
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations